3D InCites

The Fabless Model will Thrive in the 3D IC World

May. 17, 2012

In the May 15 issue of Future Fab News!, Aaron Hand, contributing editor, asked for opinions on Mark Bohr’s (Intel) now famous EE Times interview, with Rick Merritt, where he said the fabless model is collapsing and a return to the IDM is inevitable. (I addressed a similar topic a year ago in a post titled Will 3D Integration Keep 2nd Tier Foundries Alive?) So for what it’s worth, here’s m Read More>>

From Different Dimensions

What Needs to Happen for 3D-IC TSV Success

Apr. 11, 2012

I couldn't have written it better myself, so in the essence of time and to avoid redundancy, i'm re-posting this blog post from Richard Goering of Cadence, on the Panel Discussion at last week's EDPS: It's time to get to work if we want to bring 3D-ICs with through-silicon vias (TSVs) into the semiconductor design mainstream. What ecosystem support is needed in the short term, medium term, and lo Read More>>

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At Fraunhofer IZM-ASSID, It’s All Silicon, All the Time

By Francoise von Trapp On Mar. 30, 2012

One of 60 research institutes that make up Germany’s Fraunhofer Gesellschaft, the Fraunhofer Institute for Reliability and Microintegration IZM is known worldwide for its work in the realm of microelectronic packaging and system integration. The center ASSID (which stands for All Silicon System Integration Dresden) was established as a division of Fraunhofer IZM with the core mission of developing Read More>>

EV Group,Triple I at Work: The Sequel

By Francoise von Trapp On Mar. 26, 2012

Two years ago, I visited EV Group’s world headquarters in Schärding, Austria, and wrote about what they call their Triple I approach to success. Triple I stands for Invent, Innovate, Implement, and refers to EVG’s mission of getting into whatever market they target at the ground level, investing 20% of its revenue in R&D, and working alongside customers to bring new technologies to market. Read More>>

CEA-Leti: The Mother Ship Re-visted

By Francoise von Trapp On Jul. 08, 2011

Last time I visited Leti on the Minatec Campus was in October 2009. Recently, when I was back for Leti’s Annual Research Reviews, Mark Scannell, head of the 3D integration program, took me on another tour. A lot has been going on here in the past 2 years. For one thing, the building I saw going up in its early stages has been completed. There’s now a showroom displaying all the nifty Read More>>

3D Integration Research, SEMATECH Style

By Francoise von Trapp On Nov. 21, 2010

SEMATECH’s story is one that is truly built upon the essence of collaboration. SEMATECH is not a traditional research center. Rather, it is a technology research consortium that exists to serve the best interests of its worldwide members and partners. Originally established in Austin, TX as an experiment in combining government and industry to further the development of semiconductor technologies, Read More>>

Canon Marketing Japan: A Causeway to the Japanese Market

By Francoise von Trapp On Nov. 01, 2010

It’s no secret that Japan has its own ideas of how to do pretty much everything. The culture is an interesting mix of ancient tradition, ceremony, modernization, and technological advancement. The centuries-old Imperial Palace and grounds, home to the sitting Emperor, is surrounded by the steel-and-glass cosmopolitan city of Tokyo. A complex, intricate, state-of-the-art public transportation Read More>>

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EV Group: Triple I at Work, The Movie

By Q3D Notes on Apr 9, 2012

Located in Schärding Austria, EV Group manufactures wafer processing equipment targeted to th... Read More>>

Steve Anderson, STATS ChipPAC, talks about 3D eWLB and fcCuBE Platforms

By Q3D Notes on Mar 19, 2012

At IMAPS International DPC 2012, Steve Anderson, Product Marketing Manager, STATS ChipPAC, tal... Read More>>

3D Progress As Told at the 2012 IMAPS International Device Packaging Conference

By Q3D Notes on Mar 19, 2012

3D InCites talks to conference attendees and participants to find out about the progress of 2.... Read More>>

2012 IMAPS Device Packaging Conference In Pictures

By Francoise von Trapp on Mar 16, 2012

A look at who attended this year's 2012 IMAPS Device Packaging Conference in Scottsdale AZ

Bob Patti, Tezzaron Semiconductor, at the RTI 3D Architectures for Semiconductor Integration and Packaging 2011

By Q3D Notes on Dec 20, 2011

Bob Patti, CTO, Tezzaron Semiconductor, talks about the challenges and opportunities 3D integr... Read More>>

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Glass vs. Silicon Interposers for 2.5D and 3D IC Applications

By Q3D Notes On Mar. 20, 2012

There has been enough interest stirred up in R&D around glass as a low-cost alternative interposer substrate material compared with silicon, that there was an entire session dedicated to developments in that area at the 2012 IMAPS International Device Packaging conference, held March 5-8 in Scottsdale, AZ. Rao Tummala, of Georgia Tech’s 3D Packaging Center, started things off, touting the Read More>>

Leti’s Open 3D Targets Niche Market Players

By Francoise von Trapp On Feb. 07, 2012

Last week, CEA-Leti launched its Open 3D initiative to the 3D world in an effort to make its mature 3D technologies accessible to industrial and academic partners for their advanced products and research projects. Wanting to learn more about this offer than was detailed in the press release, I interviewed Leti’s David Henry, Open 3D project manager. He not only provided answers to my questions, he Read More>>

Mitsubishi Throws its Hat in the 300mm Wafer Bonding Ring

By Francoise von Trapp On Jan. 18, 2012

Earlier this week, Mitsubishi Heavy Industries, Ltd. announced it had “developed the world's first fully automated 12-inch (300 millimeters) wafer bonding machine, capable of producing 3-dimensionally integrated LSI (large-scale integration) circuits at room temperature.” This tool is targeted to the MEMS, 3D LSI's, and the RF market. I was skeptical of the words “world’s first” when I know Read More>>

Ziptronix Direct Oxide Bond Technology Gains Momentum

By Francoise von Trapp On Dec. 21, 2011

At RTI’s 3D ASIP last week, I sat down with Paul Enquist, of Ziptronix, to get an update on the company’s progress with its direct bonding technologies. Paul presented on Day 2 of the conference, but honored me with a one-on-one explanation on the application space enabled by the company’s two proprietary processes, Zibond and Direct Bond Interconnect (DBI). Zibond is the direct oxide bond Read More>>

The Great 3D Supply Chain Debate: The Handoff

By Francoise von Trapp On Dec. 20, 2011

The supply chain business model for manufacturing 3D stacked ICS has caused perhaps one of the hottest debates so far in commercializing 3D semiconductor processes. It’s easy to see why. Beyond the rather obvious question of who will own the liability of damaged devices, there’s a good deal of revenue at stake for those who make the investment in adding capacity for middle end of the line (MEOL) Read More>>

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Forum Structure

Forum Structure Most Recent Most Viewed Most Replied Most Recently Replied

Open Forums (Discussions: 4)

Last Post: Cube Technology from Cube Supe...
By Richard Harris on Mar. 30, 2012

3D MEMS Forum (Discussions: 2)

Last Post: Re:MEMS and 3D IC integration:...
By Karen Lightman on Oct. 22, 2010

SEMICON West 2010 3D Wrap-up Forum (Discussions: 7)

Last Post: Re:3D Co-Design Challenges (concluded)
By Francoise von Trapp on Aug. 02, 2010

Design Forum (Discussions: 3)

Last Post: Re:DATE 3D Workshop 2010 Previ... (concluded)
By Francoise von Trapp on Feb. 14, 2010

Alchimer's Technology Discussion (Discussions: 3)

Last Post: Overcoming weaknesses in dry p... (concluded)
By Francoise von Trapp on Nov. 08, 2009

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Apache Design Releases Fourth-Generation RedHawk for Sub-20 Nanometer Power Sign-off

By Q3D Notes On May. 02, 2012

ANSYS subsidiary Apache Design, Inc. today introduced RedHawk(TM)-3DX to meet the power, performance and price demands of low-power mobile, high-performance computing, consumer and automotive electronics. This fourth-generation power sign-off solution delivers greater accuracy, capacity and usability for full-chip dynamic power and reliability simulation to manage power consumption and improve power Read More>>

CEA-Leti Introduces LETI-3S (Silicon Specialty Solutions) Concept

By Q3D Notes On May. 02, 2012

Grenoble- based research institute, CEA-Leti, has announced it will focus on a new collaboration model for a wide range of industry oriented customers from start-ups to manufacturers. The unique, research-oriented, process and metrology tool set will offer: Advanced single step processes to high-end process modules to realize some or the entire product or simply make a proof-of-concept demonstration; Flexible Read More>>

MonolithIC 3D Inc. Issued Patents on 3D-IC Logic, Memories and Micro Display

By Q3D Notes On Apr. 25, 2012

MonolithIC 3D Inc., a Silicon Valley startup, announced today that the USPTO has issued MonolithIC 3D three additional patents on monolithic 3D IC, 3D logic and integration with image sensor or micro display, and 3D Memories. This milestone increases the company’s portfolio of issued patents from 7 to 10 over the previous ten months. These issued patents are joined by over 50 pending applications. Read More>>

3D-IC LinkedIn Group Announces Milestone in Member Subscriptions

By Francoise von Trapp On Apr. 17, 2012

The 3D-IC LinkedIn Group announced today that it has reached more than 1,100 members. The discussion forum for 3D Integrated Circuits (3D-ICs) was established in July of 2011. The increasing level of interest shown by the industry in the past few months makes this LinkedIn Group a good opportunity for industry professionals to update themselves with the latest trends in the field. The group has experienced Read More>>

Invensas Targets Ultrabooks and Tablet Applications with DIMM-IN-A-PACKAGE Solution Based on xFD Technology

By Q3D Notes On Apr. 11, 2012

Invensas Corporation, provider of semiconductor technology solutions and wholly owned subsidiary of Tessera Technologies, Inc., introduced its DIMM-IN-A-PACKAGETM multi-die face-down (xFD)TM technology for thin and light notebooks, also known as UltrabooksTM, and tablet computers. Invensas’ novel solution delivers the memory capacity and performance of a small outline dual in-line memory module Read More>>

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