3D Design, Test and Inspection

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IMEC Tech Forum Looks at Smartphones Today and in the Future

By Francoise von Trapp On Jul. 25, 2011

In this brave new world powered by consumer electronic devices that cater to the user experience, smartphones and tablets are in the driver’s seat; pushing researchers to the very limits of possibility. At imec’s technology form on Smartphones, held for the first time during SEMICON West, researchers from the institute and guest experts shared vision and progress with invited attendees. In his Read More>>

ECTC 2011 – It’s a Small World After All

By Francoise von Trapp On Jun. 13, 2011

I ask you, could there be a better place to host a conference dedicated to micro and nano electronics than Disney World, the place where all things are possible? This year’s event boasted the greatest turnout so far, (over 1000 attendees) and had such an abundance of papers that the committees could be highly selective in the ones they chose, ensuring a ‘cream of the crop’ technical agenda, between Read More>>

3D: You've Come a Long Way Baby!

By Francoise von Trapp On Feb. 16, 2011

This column by Francoise von Trapp appeared in the Jan/Feb 2011 issue of Chip Scale Review It sums up a lot of what was said at various 3D IC events over the past few months. A year ago, there were still skeptics in the room at the annual 3D Architectures for Semiconductor Integration and Packaging conference, sponsored by RTI’s Tech Venture Forum. This year, not a single hand went up when Phil Read More>>

Leti’s 300mm 3D Launch Party

By Francoise von Trapp On Jan. 28, 2011

Last week (January 18 and 19, 2011), Leti lit up Grenoble, France with the inauguration of its 300mm 3D integration, christening the region as “The Grenoble Valley ecosystem for 3D Integration.” The two-day event brought together Leti’s 3D common lab partners, spanning the supply chain to include industry partners (ST Microelectronics and ST Ericsson), equipment manufacturers (SPTS, EV Group, Read More>>

Who Wins With 3D Stacking?

By Q3D Notes On Jan. 10, 2011

In this editorial commentary, blogger Ed Sperling, of the Low Power Engineering community, talks about the opportunities 3D stacking technologise pose for EDA start-ups and vendors. There seems to be little doubt that the semiconductor industry is moving to 3D stacking. It’s simply too expensive for most companies to develop SoCs at advanced nodes from scratch when they can use existing blocks Read More>>

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Will 2.5D and 3D Compete or Coexist? 11/02/2011 9:54am

IR microscopy as an early electrical yield indicator in bonded wafer pairs used for 3D integration 05/30/2010 12:46pm

SUSS MicroTec White Papers (3) 04/01/2010 11:15am

3D Integration: A Progress Report 11/16/2009 11:55am

3D IC Design Challenges - Wally Rhines, Mentor Graphics 04/13/2011 3:38pm

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Europe Targets Leadership in Next-Generation "Smart Systems"

By Q3D Notes On Nov. 18, 2011

The partners in a new European research project today announced details of the multinational/multidisciplinary 'SMArt systems Co-design' (SMAC) program. This important three-year project, partially funded by the EU's FP7 (FP7-ICT-2011-7), aims to develop a leading-edge design and integration environment (the 'SMAC Platform') for the design of smart systems. These are intelligent, miniaturized devices Read More>>

Rudolph Fulfills Multiple System Orders for TSV Inspection and Metrology

By Q3D Notes On Oct. 03, 2011

Rudolph Technologies, Inc., provider of process characterization equipment and software for the semiconductor, solar and LED industries, announced today that it has shipped its Wafer Scanner™ 3880 3D Inspection System, multiple NSX® Macro Defect Inspection Systems and its Discover® Yield Management Software Suite to a leading semiconductor manufacturer for use in developing through silicon via Read More>>

Web Portal for 3D-ICs Joins Forces with 3D InCites

By Francoise von Trapp On Sep. 29, 2011

San Jose, CA - September 29, 2011 - With the semiconductor industry’s transition to 3D-ICs gaining momentum, online resources focused on the subject continue to emerge. Last week, 3D-ICs.com, a web portal that automatically mines the internet for news, blogs and technical publications related to 3D-ICs was launched, joining the well-regarded 3D InCites in the effort to promote 3D-IC adoption. Read More>>

BiTS Workshop Rebrands to Keep Pace with Packaging Evolution

By Francoise von Trapp On Sep. 12, 2011

The Burn‐in & Test Socket Workshop (BiTS Workshop) announced today that it is changing its name to The Burn‐in & Test Strategies Workshop (BiTS Workshop). The rebrand, which features an updated logo, is reflected in all of BiTS collateral material and the website for the 2012 BiTS Workshop that takes place March 4‐7 2012, in Mesa, AZ. “The committee elected to rebrand the workshop Read More>>

Imec Demonstrates 3D-Integrated DRAM-on-logic

By Francoise von Trapp On Jul. 20, 2011

Imec and its 3D integration partners have proven the potential of 3D integration of a commercial DRAM chip on top of a logic IC for next-generation low-power mobile applications. Imec’s applied 3D EDA (electronic design automation) tools including thermal models have proven to be valuable means to design next-generation 3D stacked ICs. The 3D stack resembles as close as possible to future commercial Read More>>

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CEA-Leti: The Mother Ship Re-visted

By Francoise von Trapp On Jul. 08, 2011

Last time I visited Leti on the Minatec Campus was in October 2009. Recently, when I was back for Leti’s Annual Research Reviews, Mark Scannell, head of the 3D integration program, took me on another tour. A lot has been going on here in the past 2 years. For one thing, the building I saw going up in its early stages has been completed. There’s now a showroom displaying all the nifty Read More>>

3D Integration Research, SEMATECH Style

By Francoise von Trapp On Nov. 21, 2010

SEMATECH’s story is one that is truly built upon the essence of collaboration. SEMATECH is not a traditional research center. Rather, it is a technology research consortium that exists to serve the best interests of its worldwide members and partners. Originally established in Austin, TX as an experiment in combining government and industry to further the development of semiconductor technologies, Read More>>

SPTS: A Wild Ride to Success

By Francoise von Trapp On Sep. 02, 2010

A year ago, things weren’t looking so great for Aviza Technologies. According to Kevin Crofton, executive VP, SPTS and managing director of the UK division, the company was in Chapter 11, mainly because its thermal division in Scotts Valley was heavily DRAM focused and was deeply affected when that market collapsed. Then to add fuel to the fire, Qimonda, one of its main customers, went into Read More>>

EV Group: "Triple I" at Work

By Francoise von Trapp On Aug. 09, 2010

It’s a good story that’s been 30 years in the making. From its founding by Erich and Aya Maria Thallner in 1980 and subsequent launch of the world’s first double-sided mask aligner for the emerging MEMS market five years later; to its most recent industry-first launch of a fully-automated wafer bonding system for high-brightness light emitting diode (HB-LED) manufacturing; EV Group has adhered Read More>>

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SEMICON West 2010 3D Wrap-up Forum (Discussions: 7)

Last Post: Re:3D Co-Design Challenges (concluded)
By Francoise von Trapp on Aug. 02, 2010

3D Packaging Forum (Discussions: 3)

Last Post: Re:Updates on Package on Packa... (concluded)
By Francoise von Trapp on Apr. 05, 2010

Open Forums (Discussions: 2)

Last Post: Re:Could moving forward with 4...
By Francoise von Trapp on Nov. 04, 2011

Design Forum (Discussions: 3)

Last Post: Re:DATE 3D Workshop 2010 Previ... (concluded)
By Francoise von Trapp on Feb. 14, 2010

Test Forum (Discussions: 1)

Last Post: Re:On the road to resolving te... (concluded)
By Francoise von Trapp on Dec. 21, 2009

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SEMI High Tech U

By Francoise von Trapp on Aug 3, 2011

In June, I spent a day at SEMI High Tech U in Tempe AZ, at EV Group's North American Headquart... Read More>>

SEMATECH 3D Interconnect program - All Surface Inspection

By Francoise von Trapp on Nov 22, 2010

Detects particles, chips and scratches as small as two microns on the top, bottom and edge bev... Read More>>

SEMATECH's 3D Integration Program: Scanning Acoustic Microscope

By Francoise von Trapp on Nov 22, 2010

Using a 110MHz transducer, ultrasonic soundwaves are transmitted or reflected through a bonded... Read More>>

Leti's 300mm clean room, open and ready for business

By Francoise von Trapp on Jul 21, 2010

Michel Brouilet talks about Leti's progress in 3D, the new cleanroom, and more..

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