At RTI’s 3D ASIP last week, I sat down with Paul Enquist, of Ziptronix, to get an update on the company’s progress with its direct bonding technologies. Paul presented on Day 2 of the conference, but honored me with a one-on-one explanation on the application space enabled by the company’s two proprietary processes, Zibond and Direct Bond Interconnect (DBI). Zibond is the direct oxide bond Read More>> |
To listen to John Lau, of ITRI, speak on the topic of 3D integration is to experience a passion for technology that rivals no other; except perhaps that of Rao Tummala of Georgia Tech. But John is definitely more vocal in his passion. Rao has a softer, gentler approach. At this year’s IWLPC in Santa Clara, both expressed their perspectives on what they see as the most cost effective and Read More>> |
At SEMICON West 2011, Prof. Rao Tummala of Georgia Tech presented the unique glass and silicon-based 3D Interposer technologies being developed at Georgia Tech, claimed to be simpler and cheaper than 3D ICs with TSV for many mobile and consumer applications at SemiconWest 2011. in his presentation, Tummala discussed the primary differences and challenges between traditional industry's approach to Read More>> |
When we talk about 3D integration, we’re generally talking about 3D ICs driven by mobile market performance needs. But in the power semiconductor market, computing application performance needs are also spiking due to the increase of content like broadband mobile video and 4G communications. At the same time, telecommunications and computing equipment needs to take up less space, notes TI spokesman Read More>> |
In this brave new world powered by consumer electronic devices that cater to the user experience, smartphones and tablets are in the driver’s seat; pushing researchers to the very limits of possibility. At imec’s technology form on Smartphones, held for the first time during SEMICON West, researchers from the institute and guest experts shared vision and progress with invited attendees.
In his Read More>> |
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