3D Manufacturing Equipment

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Mitsubishi Throws its Hat in the 300mm Wafer Bonding Ring

By Francoise von Trapp On Jan. 18, 2012

Earlier this week, Mitsubishi Heavy Industries, Ltd. announced it had “developed the world's first fully automated 12-inch (300 millimeters) wafer bonding machine, capable of producing 3-dimensionally integrated LSI (large-scale integration) circuits at room temperature.” This tool is targeted to the MEMS, 3D LSI's, and the RF market. I was skeptical of the words “world’s first” when I know Read More>>

The Great 3D Supply Chain Debate: The Handoff

By Francoise von Trapp On Dec. 20, 2011

The supply chain business model for manufacturing 3D stacked ICS has caused perhaps one of the hottest debates so far in commercializing 3D semiconductor processes. It’s easy to see why. Beyond the rather obvious question of who will own the liability of damaged devices, there’s a good deal of revenue at stake for those who make the investment in adding capacity for middle end of the line (MEOL) Read More>>

Things are humming along at EV Group

By Francoise von Trapp On Jul. 27, 2011

“Keeping busy” doesn’t begin to describe what’s happening at EV Group these days. I sat down with Markus Wimplinger, Corporate Technology Development and IP Director, EVG, at SEMICON West for a full briefing of the company’s latest corporate and technology developments. Remaining true to their mission of “invent, innovate, implement” gave us a lot to talk about. Technology DevelopmentsFirst Read More>>

Thermocompression Bonding for Microbump Flip Chip Soldering

By Q3D Notes On Jul. 19, 2011

An excerpt from the Semiconductor Assembly Blog by Andy C. Mackie, Global Product Manager for Indium Corporation's Semiconductor and Advanced Assembly Materials. For reasons that I will discuss in a post later this year, a common factor that is emerging in the area of copper-pillar microbump 2.5D and 3D joining, is the adoption of thermocompression (TC) bonding for flip-chip flux/microbump soldering. Read More>>

ECTC 2011 – It’s a Small World After All

By Francoise von Trapp On Jun. 13, 2011

I ask you, could there be a better place to host a conference dedicated to micro and nano electronics than Disney World, the place where all things are possible? This year’s event boasted the greatest turnout so far, (over 1000 attendees) and had such an abundance of papers that the committees could be highly selective in the ones they chose, ensuring a ‘cream of the crop’ technical agenda, between Read More>>

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CEA-Leti: The Mother Ship Re-visted

By Francoise von Trapp On Jul. 08, 2011

Last time I visited Leti on the Minatec Campus was in October 2009. Recently, when I was back for Leti’s Annual Research Reviews, Mark Scannell, head of the 3D integration program, took me on another tour. A lot has been going on here in the past 2 years. For one thing, the building I saw going up in its early stages has been completed. There’s now a showroom displaying all the nifty Read More>>

3D Integration Research, SEMATECH Style

By Francoise von Trapp On Nov. 21, 2010

SEMATECH’s story is one that is truly built upon the essence of collaboration. SEMATECH is not a traditional research center. Rather, it is a technology research consortium that exists to serve the best interests of its worldwide members and partners. Originally established in Austin, TX as an experiment in combining government and industry to further the development of semiconductor technologies, Read More>>

Canon Marketing Japan: A Causeway to the Japanese Market

By Francoise von Trapp On Nov. 01, 2010

It’s no secret that Japan has its own ideas of how to do pretty much everything. The culture is an interesting mix of ancient tradition, ceremony, modernization, and technological advancement. The centuries-old Imperial Palace and grounds, home to the sitting Emperor, is surrounded by the steel-and-glass cosmopolitan city of Tokyo. A complex, intricate, state-of-the-art public transportation Read More>>

SPTS: A Wild Ride to Success

By Francoise von Trapp On Sep. 02, 2010

A year ago, things weren’t looking so great for Aviza Technologies. According to Kevin Crofton, executive VP, SPTS and managing director of the UK division, the company was in Chapter 11, mainly because its thermal division in Scotts Valley was heavily DRAM focused and was deeply affected when that market collapsed. Then to add fuel to the fire, Qimonda, one of its main customers, went into Read More>>

EV Group: "Triple I" at Work

By Francoise von Trapp On Aug. 09, 2010

It’s a good story that’s been 30 years in the making. From its founding by Erich and Aya Maria Thallner in 1980 and subsequent launch of the world’s first double-sided mask aligner for the emerging MEMS market five years later; to its most recent industry-first launch of a fully-automated wafer bonding system for high-brightness light emitting diode (HB-LED) manufacturing; EV Group has adhered Read More>>

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SEMATECH to conduct rigorous manufacturability assessments to enable high volume manufacturing readiness of 3D technology

By Q3D Notes On Jan. 16, 2012

To enable high-volume production readiness of 3D-based products, SEMATECH’s 3D Interconnect and Manufacturability programs will be conducting Equipment Maturity Assessments (EMAs) of several critical 3D tools during 2012 to establish functional equipment capabilities and address high volume manufacturing maturity issues. The assessment is a cooperative effort among experts from SEMATECH’s 3D program, Read More>>

SUSS MicroTec launches XBS300, the next generation Temporary Bonder for 200mm and 300mm High-Volume Production

By Q3D Notes On Dec. 05, 2011

SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, launched the XBS300 Temporary Bonder, SUSS MicroTec's latest generation of high volume manufacturing temporary bond systems. This Bond Cluster is configured to temporarily bond 200mm and 300mm wafers for 3D integration applications as well as other processes that require thin wafer handling. Read More>>

EV Group Boosts High-Volume Manufacturing Performance Across Product Lines With New XT Frame Equipment Platform

By Q3D Notes On Dec. 05, 2011

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has introduced a new equipment platform, dubbed the XT Frame, that extends process throughput and tool functionality for virtually all of its current volume-manufacturing product offerings. Specifically designed to address new requirements from Read More>>

Applied Materials Introduces Technology to Enable Advanced Image Sensors for Smartphones

By Q3D Notes On Dec. 05, 2011

Applied Materials, Inc. announced its new Applied Producer®OptivaTM CVD system that enables the manufacture of state-of-the-art, backside-illuminated (BSI) image sensors used in the most advanced smartphones, tablet PCs and high-end cameras. The innovative Producer Optiva system is uniquely capable of depositing low temperature, conformal films that boost the low-light performance of the sensor Read More>>

Brewer Science and SUSS MicroTec Jointly Commercialize ZoneBOND™ Technology for Thin Wafer Handling

By Q3D Notes On Dec. 05, 2011

Brewer Science, Inc., the inventor of ZoneBOND™ technology and world leading expert in materials and processes for thin wafer handling, and SUSS MicroTec, a leading supplier of equipment, are joining forces in commercializing ZoneBOND™ technology for thin wafer handling. SUSS MicroTec, market leader in room temperature debonding process equipment, is now offering the Brewer Science ZoneBOND™ Read More>>

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