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This topic center focuses on the latest  developments, acheivements, and successes for our sponsors involved in 3D materials.

 
 

3D Materials In-Depth (20 postings)

Most Recent
 
By Francoise von Trapp On Dec. 20, 2011
The supply chain business model for manufacturing 3D stacked ICS has caused perhaps one of the hottest debates so far in commercializing 3D semiconductor processes.  It’s easy to see why. Beyond the rather obvious question of who will own the liability of damaged devices, there’s a good deal of revenue at stake for those who make the investment in adding capacity for middle end of the line (MEOL) Read More>>
By Q3D Notes On Jul. 19, 2011
An excerpt from  the Semiconductor Assembly Blog by Andy C. Mackie, Global Product Manager for Indium Corporation's Semiconductor and Advanced Assembly Materials. For reasons that I will discuss in a post later this year, a common factor that is emerging in the area of copper-pillar microbump 2.5D and 3D joining, is the adoption of thermocompression (TC) bonding for flip-chip flux/microbump soldering. Read More>>
By Francoise von Trapp On Jun. 13, 2011
I ask you, could there be a better place to host a conference dedicated to micro and nano electronics than Disney World, the place where all things are possible? This year’s event boasted the greatest turnout so far, (over 1000 attendees) and had such an abundance of papers that the committees could be highly selective in the ones they chose, ensuring a ‘cream of the crop’ technical agenda, between Read More>>
4
By Francoise von Trapp On May. 30, 2011
Alchimer’s latest technology breakthrough is an interesting twist on the way semiconductor solutions generally presents themselves. We’re used to hearing about scaling that goes from bigger to smaller. This is the first time I’ve heard of a technology that scales UP to meet application needs. But that’s precisely the differentiation between Alchimer’s flagship suite of wet deposition processes, Read More>>
By Francoise von Trapp On Apr. 05, 2011
Last week’s announcement of Alchimer’s expansion into Taiwan via its Representative agreement with Kromax International Corp. further exemplifies the company’s strategy to provide not only a disruptive process, but the infrastructure with which to execute. Kromax is a Taiwanese company that represents semiconductor and flat-panel equipment manufacturers and material suppliers in the Asian market. Read More>>
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Sponsored Site Tour (5 postings)

Most Recent
 
By Francoise von Trapp On Jul. 08, 2011
Last time I visited Leti on the Minatec Campus was in October 2009.  Recently, when I was back for Leti’s Annual Research Reviews, Mark Scannell, head of the 3D integration program, took me on another tour. A lot has been going on here in the past 2 years. For one thing, the building I saw going up in its early stages has been completed.  There’s now a showroom displaying all the nifty Read More>>
By Francoise von Trapp On Nov. 21, 2010
SEMATECH’s story is one that is truly built upon the essence of collaboration.  SEMATECH is not a traditional research center.  Rather, it is a technology research consortium that exists to serve the best interests of its worldwide members and partners. Originally established in Austin, TX as an experiment in combining government and industry to further the development of semiconductor technologies, Read More>>
By Francoise von Trapp On Sep. 02, 2010
A year ago, things weren’t looking so great for Aviza Technologies. According to Kevin Crofton, executive VP, SPTS and managing director of the UK division, the company was in Chapter 11, mainly because its thermal division in Scotts Valley was heavily DRAM focused and was deeply affected when that market collapsed. Then to add fuel to the fire, Qimonda, one of its main customers, went into Read More>>
By Francoise von Trapp On Aug. 09, 2010
It’s a good story that’s been 30 years in the making. From its founding by Erich and Aya Maria Thallner in 1980 and subsequent launch of the world’s first double-sided mask aligner for the emerging MEMS market five years later; to its most recent industry-first launch of a fully-automated wafer bonding system for high-brightness light emitting diode (HB-LED) manufacturing; EV Group has adhered Read More>>
By Francoise von Trapp On Nov. 03, 2009
In an understated research lab and recently upgraded demo facility located just outside Paris in Massy, France, Alchimer scientists are working diligently to prove the readiness of an elegant and innovative electrochemical-based process for the growth of nanometric thin films of various types on both conducting and semiconducting surfaces. The technology has the potential to revolutionize process integration and cost models for 3D TSVs. Read More>>
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Forums (5 forums , 15 discussions)

Forum Structure
 

Last Post: Re:3D Co-Design Challenges (concluded)
By Francoise von Trapp on Aug. 02, 2010
3D Packaging Forum (Discussions: 3)
Last Post: Re:Updates on Package on Packa... (concluded)
By Francoise von Trapp on Apr. 05, 2010
Open Forums (Discussions: 2)
3D MEMS Forum (Discussions: 2)
Last Post: Re:MEMS and 3D IC integration:...
By Karen Lightman on Oct. 22, 2010
3D Processes Forum (Discussions: 1)
Last Post: Re:3D Stacking Methods for TSV... (concluded)
By Francoise von Trapp on May. 10, 2010
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Press Releases (40 postings)

Most Recent
 
By Q3D Notes On Dec. 05, 2011
Brewer Science, Inc., the inventor of ZoneBOND™ technology and world leading expert in materials and processes for thin wafer handling, and SUSS MicroTec, a leading supplier of equipment, are joining forces in commercializing ZoneBOND™ technology for thin wafer handling. SUSS MicroTec, market leader in room temperature debonding process equipment, is now offering the Brewer Science ZoneBOND™ Read More>>
By Q3D Notes On Nov. 29, 2011
Applied Materials, Inc. today announced a breakthrough technology for reducing power consumption in semiconductor chips with its new Applied Producer® OnyxTM film treatment system. By optimizing the molecular structure of the low k films that insulate the miles of wiring, or interconnects, on each chip, the Producer Onyx system enables customers to continue their relentless drive to fabricate Read More>>
By Francoise von Trapp On Nov. 01, 2011
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. , announced today that it has acquired the patent assets of ALLVIA, Inc. In addition, Invensas has entered into a two-year collaborative partnership with ALLVIA to further develop technology and intellectual property (IP) in the 3-dimensional integrated circuit (3D-IC) packaging space. The Read More>>
By Francoise von Trapp On Sep. 29, 2011
San Jose, CA - September 29, 2011 - With the semiconductor industry’s transition to 3D-ICs gaining momentum, online resources focused on the subject continue to emerge. Last week, 3D-ICs.com, a web portal that automatically mines the internet for news, blogs and technical publications related to 3D-ICs was launched, joining the well-regarded 3D InCites in the effort to promote 3D-IC adoption. Read More>>
By Q3D Notes On Sep. 06, 2011
A new film-deposition technology advance from Alchimer S.A.is said to cut fill deposition times and could provide new options for the electronics packaging industry as it struggles to bring through-silicon vias (TSVs) into cost-effective production. Alchimer has disclosed that its AquiVia TSV barrier-layer process has the ability to provide uniform, guaranteed 100% step coverage over complex silicon Read More>>
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Topic Centers

3D Design, Test and Inspection
3D Devices
3D Manufacturing Equipment
3D Materials
3D Processes and Technology
3D R&D and Collaboration
 
 

White Papers (12 files)

3D_Integration_Panel_DiscussionMASTER.pptx Will 2.5D and 3D Compete or Coexist? 11/02/2011 9:54am
Semicon West 2010 WorkshopAlchimer.pdf Alchimer Workshop Focuses on Cost-effective TSVs 07/27/2010 2:29am
SUSS MicroTec White Papers (3) 04/01/2010 11:15am
3D IC Integration White paper FINAL.pdf 3D Integration: A Progress Report 11/16/2009 11:55am
3Mpaper.pdf The Use of Segregated Hydrofluoroethers as Cleaning Agents in Electronic Packaging Applications 08/31/2009 1:54pm
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Videos (6)

Most Recent
 

SEMI High Tech U
By Francoise von Trapp on Aug 3, 2011

In June, I spent a day at SEMI High Tech U in Tempe AZ, at EV Group's North American Headquart... Read More>>

SEMATECH 3D Interconnect program - Wafer bonding tool
By Francoise von Trapp on Nov 22, 2010

The Gemini is a fully automated 300mm wafer bonding tool. It also has modules for precision wa... Read More>>

EV Group Celebrates 30 years at SEMICON West 2010
By Francoise von Trapp on Jul 16, 2010

EV Group's annual reception at SEMICON West was extra special this year, as the company celebr... Read More>>

Multidimensions at This Year's SUSS MicroTec Booth at Semicon West 2010
By SUSS MicroTec Admin on Jul 16, 2010

Frank Averdung, President and CEO of SUSS MicroTec talks about SEMICON West 2010

Read More>>
SUSS MicroTec Workshop 2010: Thin Wafer Processing for 3D TSV Applications
By Francoise von Trapp on Jul 15, 2010

Recognizing a need for cooperation across the supply chain in order to realize commercializati... Read More>>

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Moti Yanuka joined the 3D Materials site.
Kevin Hess joined the 3D Materials site.
GS Kim joined the 3D Materials site.
Wentssai Jen joined the 3D Materials site.
Francoise von Trapp created the posting The Great 3D Supply Chain Debate: The Handoff.
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