By Q3D Notes On Jun. 17, 2010
Keith Cooper, Technology and Development, SET North America reports from ECTC 2010's Medical Device Market Panel, offering a view beyond the packaging lab, into the progress and potential of the medical devices that will benefit from 3D integration technologies. A discussion panel on medical devices opened this year’s Electronic Components and Technology Conference (ECTC) in Las Vegas. Chaired Read More>>
By Q3D Notes On Nov. 16, 2010
Keith Cooper, Technology and Development, SET North America reports from 2010 IMAPS International , where he attended the 3D Panel, “Roadmap, Technical and Business Progress of 3D Integration and Packaging”. At the recent IMAPS Annual Meeting in Raleigh, NC, a panel of 3D experts addressed a series of questions moderated by Prof. James Lu of RPI.   While individual opinions on the panel Read More>>
By Francoise von Trapp On Sep. 27, 2010
This was my second year attending the Medical Electronics Symposium, and I’m not sure what I was expecting, but when it came to technology advancements themselves, I noticed that not much exciting has happened since last year. Or maybe I’ve just been spoiled.  Not every year can be about earth-shattering technological breakthroughs. This was the year about continuing progress of the breakthroughs Read More>>
By Q3D Notes On May. 30, 2010
In this article, published in the May/June 2010 issue of Chip Scale Review Magazine, Steve Lerner, CEO, Alchimer, proposes a "variation on theme" for TSV cost-of-ownership. 3D integration and More-than-Moore are popular topics in the semiconductor industry, with Read More>>
By Q3D Notes On Apr. 24, 2010
In this post written and submitted by John H. Lau, Electronics & Optoelectronics Laboratory, ITRI, the true inventor of the Through Silcon Via (TSV) is revealed. Read More>>