By Francoise von Trapp On Jan. 18, 2012
Earlier this week, Mitsubishi Heavy Industries, Ltd. announced it had “developed the world's first fully automated 12-inch (300 millimeters) wafer bonding machine, capable of producing 3-dimensionally integrated LSI (large-scale integration) circuits at room temperature.” This tool is targeted to the MEMS, 3D LSI's, and the RF market. I was skeptical of the words “world’s first” when I know Read More>>
By Francoise von Trapp On Dec. 21, 2011
At RTI’s 3D ASIP last week, I sat down with Paul Enquist, of Ziptronix, to get an update on the company’s progress with its direct bonding technologies.  Paul presented on Day 2 of the conference, but honored me with a one-on-one explanation on the application space enabled by the company’s two proprietary processes, Zibond and Direct Bond Interconnect (DBI).  Zibond is the direct oxide bond Read More>>
By Francoise von Trapp On Dec. 20, 2011
The supply chain business model for manufacturing 3D stacked ICS has caused perhaps one of the hottest debates so far in commercializing 3D semiconductor processes.  It’s easy to see why. Beyond the rather obvious question of who will own the liability of damaged devices, there’s a good deal of revenue at stake for those who make the investment in adding capacity for middle end of the line (MEOL) Read More>>
By Francoise von Trapp On Nov. 03, 2011
Earlier this week Invensas Corporation, a wholly-owned subsidiary of Tessera Technologies, Inc., announced both its acquisition of ALLVIA’s patent assets, and a two-year collaborative partnership with ALLVIA to further develop technology and intellectual property (IP) in the 3-dimensional integrated circuit (3D-IC) packaging space.  This strategic alliance is expected to optimize the strengths of Read More>>
By Francoise von Trapp On Oct. 13, 2011
To listen to John Lau, of ITRI, speak on the topic of 3D integration is to experience a passion for technology that rivals no other; except perhaps that of Rao Tummala of Georgia Tech.  But John is definitely more vocal in his passion. Rao has a softer, gentler approach.  At this year’s IWLPC in Santa Clara, both expressed their perspectives on what they see as the most cost effective and Read More>>