By Q3D Notes On Jun. 17, 2010
Keith Cooper, Technology and Development, SET North America reports from ECTC 2010's Medical Device Market Panel, offering a view beyond the packaging lab, into the progress and potential of the medical devices that will benefit from 3D integration technologies. A discussion panel on medical devices opened this year’s Electronic Components and Technology Conference (ECTC) in Las Vegas. Chaired Read More>>
By Francoise von Trapp On Sep. 27, 2010
This was my second year attending the Medical Electronics Symposium, and I’m not sure what I was expecting, but when it came to technology advancements themselves, I noticed that not much exciting has happened since last year. Or maybe I’ve just been spoiled.  Not every year can be about earth-shattering technological breakthroughs. This was the year about continuing progress of the breakthroughs Read More>>
By Q3D Notes On Mar. 20, 2012
There has been enough interest stirred up in R&D around glass as a low-cost alternative interposer substrate material compared with silicon, that there was an entire session dedicated to developments in that area at the 2012 IMAPS International Device Packaging conference, held March 5-8 in Scottsdale, AZ.  Rao Tummala, of Georgia Tech’s 3D Packaging Center, started things off, touting the Read More>>
By Francoise von Trapp On Dec. 20, 2011
The supply chain business model for manufacturing 3D stacked ICS has caused perhaps one of the hottest debates so far in commercializing 3D semiconductor processes.  It’s easy to see why. Beyond the rather obvious question of who will own the liability of damaged devices, there’s a good deal of revenue at stake for those who make the investment in adding capacity for middle end of the line (MEOL) Read More>>
By Q3D Notes On Jul. 19, 2011
An excerpt from  the Semiconductor Assembly Blog by Andy C. Mackie, Global Product Manager for Indium Corporation's Semiconductor and Advanced Assembly Materials. For reasons that I will discuss in a post later this year, a common factor that is emerging in the area of copper-pillar microbump 2.5D and 3D joining, is the adoption of thermocompression (TC) bonding for flip-chip flux/microbump soldering. Read More>>