By Q3D Notes On Mar. 20, 2012
There has been enough interest stirred up in R&D around glass as a low-cost alternative interposer substrate material compared with silicon, that there was an entire session dedicated to developments in that area at the 2012 IMAPS International Device Packaging conference, held March 5-8 in Scottsdale, AZ.  Rao Tummala, of Georgia Tech’s 3D Packaging Center, started things off, touting the Read More>>
By Francoise von Trapp On Dec. 20, 2011
The supply chain business model for manufacturing 3D stacked ICS has caused perhaps one of the hottest debates so far in commercializing 3D semiconductor processes.  It’s easy to see why. Beyond the rather obvious question of who will own the liability of damaged devices, there’s a good deal of revenue at stake for those who make the investment in adding capacity for middle end of the line (MEOL) Read More>>
By Q3D Notes On Jul. 19, 2011
An excerpt from  the Semiconductor Assembly Blog by Andy C. Mackie, Global Product Manager for Indium Corporation's Semiconductor and Advanced Assembly Materials. For reasons that I will discuss in a post later this year, a common factor that is emerging in the area of copper-pillar microbump 2.5D and 3D joining, is the adoption of thermocompression (TC) bonding for flip-chip flux/microbump soldering. Read More>>
By Francoise von Trapp On Jun. 13, 2011
I ask you, could there be a better place to host a conference dedicated to micro and nano electronics than Disney World, the place where all things are possible? This year’s event boasted the greatest turnout so far, (over 1000 attendees) and had such an abundance of papers that the committees could be highly selective in the ones they chose, ensuring a ‘cream of the crop’ technical agenda, between Read More>>
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By Francoise von Trapp On May. 30, 2011
Alchimer’s latest technology breakthrough is an interesting twist on the way semiconductor solutions generally presents themselves. We’re used to hearing about scaling that goes from bigger to smaller. This is the first time I’ve heard of a technology that scales UP to meet application needs. But that’s precisely the differentiation between Alchimer’s flagship suite of wet deposition processes, Read More>>