By Francoise von Trapp On Nov. 01, 2010
Attending last week’s TSV Seminar in Tokyo, hosted by Electronic Journal, posed a bit of a challenge as all but one presentation was in Japanese. However, thanks to the detailed diagrams and smatterings of English in the proceedings along with careful note taking by Tegal Corp.'s interpreter Yukumi Hayafune, I was able to summarize the main points of the event. But first, a word about the different Read More>>
By Francoise von Trapp On Oct. 18, 2010
I caught up with Alchimer CEO, Steve Lerner last week at the IWLPC in Santa Clara, to find out how things have progressed since news of Panasonic Investment Partners’ equity investment in the company back in July. It turns out setting up shop in Asia has been a great strategic move for the start-up. Last week’s announcement of the Alchimer’s licensing agreement with Nagase ChemteX unit of Tokyo-based Read More>>
By Francoise von Trapp On Mar. 23, 2011
As chip-to-wafer (C2W) stacking has been identified by most technologists as the best approach to 3D stacking for optimum yields and the ability to stack dies of different sizes — especially in memory/logic stacks — a number of approaches have been or are being developed by various collaboratives.  At IMAPS Device Packaging, held March 8-10, 2011 in Scottsdale AZ, two approaches were presented Read More>>
By Francoise von Trapp On Oct. 21, 2010
When a research institute is evaluating different options for technology partnerships, what tips the scales in favor of one supplier over another? In the case of the recently announced common lab agreement between Leti and SPP Technology Process Systems (SPTS) to further develop processes for high aspect ratio TSVs, it was a matter of finding the ideal mix of key elements that included an established Read More>>
By Francoise von Trapp On Jan. 28, 2011
Last week (January 18 and 19, 2011), Leti lit up Grenoble, France with the inauguration of its 300mm 3D integration, christening the region as “The Grenoble Valley ecosystem for 3D Integration.” The two-day event brought together Leti’s 3D common lab partners, spanning the supply chain to include industry partners (ST Microelectronics and ST Ericsson), equipment manufacturers (SPTS, EV Group, Read More>>