By Q3D Notes On Aug. 19, 2009
Over the past few years, the quest for low-cost TSV manufacturing has inspired innovation throughout the industry. While larger, established companies look to leverage and optimize their core competencies to find low cost solutions for various process steps required for manufacturing TSVs, a number of start-ups have taken this opportunity to develop disruptive technologies that challenge existing infrastructure. 3D InCites recently heard from one of these, Laserfacturing, which has developed a laser ablation alternative to deep reactive ion etching (DRIE) for TSV formation. Read More>>
By Q3D Notes On Aug. 22, 2011
At SEMICON West 2011, Prof. Rao Tummala of Georgia Tech presented the unique glass and silicon-based 3D Interposer technologies being developed at Georgia Tech, claimed to be simpler and cheaper than 3D ICs with TSV for many mobile and consumer applications at SemiconWest 2011.  in his presentation, Tummala discussed the primary differences and challenges between traditional industry's approach to Read More>>
By Q3D Notes On Jul. 17, 2009
One thing is clear, no matter who you talk to or what their current focus is: ultimately, wafer-to-wafer bonding will be the way to go for cost effective 3D IC stacks with TSV. That is, once all the bugs are worked out so high enough yields at desired densities, speed and performance can be achieved. To this end, the Soitec Group, supplier of silicon-on-insulator (SOI) and other engineered substrates, has entered the race, forming a collaborative partnership with IBM to pioneer 22nm silicon wafer substrate and bonding techniques that will enable wafer-level 3D IC integration. Read More>>
By Francoise von Trapp On Jul. 10, 2009
WDoD stands for wirefree die-on-die, and according to its creator, Dr. Christian Val, CEO of 3D Plus, it could very well turn out to be a way around TSV to achieve heterogeneous stacks for 3D systems-in-package applications.In an exclusive interview yesterday, VAL explained how WDoD works, and why he thinks it’s a better option than TSV. Read More>>
By Francoise von Trapp On Nov. 01, 2010
Attending last week’s TSV Seminar in Tokyo, hosted by Electronic Journal, posed a bit of a challenge as all but one presentation was in Japanese. However, thanks to the detailed diagrams and smatterings of English in the proceedings along with careful note taking by Tegal Corp.'s interpreter Yukumi Hayafune, I was able to summarize the main points of the event. But first, a word about the different Read More>>