By Q3D Notes On Jun. 17, 2010
Keith Cooper, Technology and Development, SET North America reports from ECTC 2010's Medical Device Market Panel, offering a view beyond the packaging lab, into the progress and potential of the medical devices that will benefit from 3D integration technologies. A discussion panel on medical devices opened this year’s Electronic Components and Technology Conference (ECTC) in Las Vegas. Chaired Read More>>
By Q3D Notes On Nov. 18, 2009
There is a natural progression that emerging technologies follow as they make their way from the drawing board to market adoption and volume production. As such, each sector of the supply chain is called to action at different stages along that technology’s evolution. At each bend in the road, the emerging technology becomes a driver for process development, next-generation manufacturing tools, new materials, design tools, inspection tools, test, measurement and reliability methodologies, etc. Read More>>
By Francoise von Trapp On Jul. 25, 2011
In this brave new world powered by consumer electronic devices that cater to the user experience, smartphones and tablets are in the driver’s seat; pushing researchers to the very limits of possibility. At imec’s technology form on Smartphones, held for the first time during SEMICON West, researchers from the institute and guest experts shared vision and progress with invited attendees. In his Read More>>
By Francoise von Trapp On Jun. 13, 2011
I ask you, could there be a better place to host a conference dedicated to micro and nano electronics than Disney World, the place where all things are possible? This year’s event boasted the greatest turnout so far, (over 1000 attendees) and had such an abundance of papers that the committees could be highly selective in the ones they chose, ensuring a ‘cream of the crop’ technical agenda, between Read More>>
By Francoise von Trapp On Feb. 16, 2011
This column by Francoise von Trapp appeared in the Jan/Feb 2011 issue of Chip Scale Review It sums up a lot of what was said at various 3D IC events over the past few months. A year ago, there were still skeptics in the room at the annual 3D Architectures for Semiconductor Integration and Packaging conference, sponsored by RTI’s Tech Venture Forum. This year, not a single hand went up when Phil Read More>>