By Q3D Notes On Nov. 18, 2011
The partners in a new European research project today announced details of the multinational/multidisciplinary 'SMArt systems Co-design' (SMAC) program. This important three-year project, partially funded by the EU's FP7 (FP7-ICT-2011-7), aims to develop a leading-edge design and integration environment (the 'SMAC Platform') for the design of smart systems. These are intelligent, miniaturized devices Read More>>
By Q3D Notes On Oct. 03, 2011
Rudolph Technologies, Inc., provider of process characterization equipment and software for the semiconductor, solar and LED industries, announced today that it has shipped its Wafer Scanner™ 3880 3D Inspection System, multiple NSX® Macro Defect Inspection Systems and its Discover® Yield Management Software Suite to a leading semiconductor manufacturer for use in developing through silicon via Read More>>
By Francoise von Trapp On Sep. 29, 2011
San Jose, CA - September 29, 2011 - With the semiconductor industry’s transition to 3D-ICs gaining momentum, online resources focused on the subject continue to emerge. Last week, 3D-ICs.com, a web portal that automatically mines the internet for news, blogs and technical publications related to 3D-ICs was launched, joining the well-regarded 3D InCites in the effort to promote 3D-IC adoption. Read More>>
By Francoise von Trapp On Sep. 12, 2011
The Burn‐in & Test Socket Workshop (BiTS Workshop) announced today that it is changing its name to The Burn‐in & Test Strategies Workshop (BiTS Workshop). The rebrand, which features an updated logo, is reflected in all of BiTS collateral material and the website for the 2012 BiTS Workshop that takes place March 4‐7 2012, in Mesa, AZ. “The committee elected to rebrand the workshop Read More>>
By Francoise von Trapp On Jul. 20, 2011
Imec and its 3D integration partners have proven the potential of 3D integration of a commercial DRAM chip on top of a logic IC for next-generation low-power mobile applications. Imec’s applied 3D EDA (electronic design automation) tools including thermal models have proven to be valuable means to design next-generation 3D stacked ICs. The 3D stack resembles as close as possible to future commercial Read More>>