By Francoise von Trapp On Jul. 25, 2011
In this brave new world powered by consumer electronic devices that cater to the user experience, smartphones and tablets are in the driver’s seat; pushing researchers to the very limits of possibility. At imec’s technology form on Smartphones, held for the first time during SEMICON West, researchers from the institute and guest experts shared vision and progress with invited attendees. In his Read More>>
By Francoise von Trapp On Jun. 13, 2011
I ask you, could there be a better place to host a conference dedicated to micro and nano electronics than Disney World, the place where all things are possible? This year’s event boasted the greatest turnout so far, (over 1000 attendees) and had such an abundance of papers that the committees could be highly selective in the ones they chose, ensuring a ‘cream of the crop’ technical agenda, between Read More>>
By Francoise von Trapp On Feb. 16, 2011
This column by Francoise von Trapp appeared in the Jan/Feb 2011 issue of Chip Scale Review It sums up a lot of what was said at various 3D IC events over the past few months. A year ago, there were still skeptics in the room at the annual 3D Architectures for Semiconductor Integration and Packaging conference, sponsored by RTI’s Tech Venture Forum. This year, not a single hand went up when Phil Read More>>
By Francoise von Trapp On Jan. 28, 2011
Last week (January 18 and 19, 2011), Leti lit up Grenoble, France with the inauguration of its 300mm 3D integration, christening the region as “The Grenoble Valley ecosystem for 3D Integration.” The two-day event brought together Leti’s 3D common lab partners, spanning the supply chain to include industry partners (ST Microelectronics and ST Ericsson), equipment manufacturers (SPTS, EV Group, Read More>>
By Q3D Notes On Jan. 10, 2011
In this editorial commentary, blogger Ed Sperling, of the Low Power Engineering community, talks about the opportunities 3D stacking technologise pose for EDA start-ups and vendors. There seems to be little doubt that the semiconductor industry is moving to 3D stacking. It’s simply too expensive for most companies to develop SoCs at advanced nodes from scratch when they can use existing blocks Read More>>