By Francoise von Trapp On Jan. 28, 2011
Last week (January 18 and 19, 2011), Leti lit up Grenoble, France with the inauguration of its 300mm 3D integration, christening the region as “The Grenoble Valley ecosystem for 3D Integration.” The two-day event brought together Leti’s 3D common lab partners, spanning the supply chain to include industry partners (ST Microelectronics and ST Ericsson), equipment manufacturers (SPTS, EV Group, Read More>>
By Francoise von Trapp On Oct. 11, 2009
There’s no doubt about it, IMEC’s 3D TSV technology's march towards maturity is picking up speed. At last week’s technology forum, Pol Marchal, principal scientist of IMEC’s 3D-SoC design initiative, gave us an update on progress since last year, analogizing the evolution with raising a leopard cub from baby to adulthood – or as he titled his presentation, “Growing up from Baby to Killer Technology.” Read More>>
By Francoise von Trapp On Jul. 02, 2009
Contributed by Yann Guillou, ST Ericsson. Read More>>
By Francoise von Trapp On Oct. 21, 2010
Program chair Erik Volkerink of Verigy discusses this year's International Test Conference in an interview with Rick Nelson, Chief Editor, Test and Measurment World. The testing of 3-D chips, protocol-aware test, and concurrent test will be key topics on the agenda of the 41st International Test Conference October 31 through November 5 in Austin TX. While the test of 3-D chips was a key focus at last Read More>>
By Q3D Notes On Jun. 17, 2010
Keith Cooper, Technology and Development, SET North America reports from ECTC 2010's Medical Device Market Panel, offering a view beyond the packaging lab, into the progress and potential of the medical devices that will benefit from 3D integration technologies. A discussion panel on medical devices opened this year’s Electronic Components and Technology Conference (ECTC) in Las Vegas. Chaired Read More>>