By Q3D Notes On Dec. 07, 2010
SEMI announced today the formation of a Three-Dimensional Stacked Integrated Circuits (3DS-IC) Standards Committee. 3DS-ICs are composed of a stack of two-dimensional die, and are viewed as critical in helping the semiconductor industry keep pace with Moore’s Law. Current integration methods like wirebond and flip chip have been in production for some time, but the next generation of 3D integration Read More>>
By Q3D Notes On Dec. 08, 2010
SEMATECH, the Semiconductor Industry Association (SIA), and Semiconductor Research Corporation (SRC) announced today they have established a new 3D Enablement program to drive cohesive industry standardization efforts and technical specifications for heterogeneous 3D integration.  Administered by SEMATECH’s 3D Interconnect program, based at the College of Nanoscale Science and Engineering (CNSE) Read More>>
By Q3D Notes On Nov. 08, 2010
SPP Process Technology Systems (SPTS) announced the opening of its new facility in San Jose, CA, serving as the home for the company’s Thermal Products Division, and sales and support headquarters for North America. The Thermal Products Division was relocated from Scotts Valley, California. In October 2009, Sumitomo Precision Products (SPP) acquired assets of Aviza Technology and subsequently integrated Read More>>
By Q3D Notes On Feb. 09, 2011
SPP Process Technology Systems (SPTS), has received a follow on purchase order from CEA-Leti for its Sigma® fxPTM Physical Vapor Deposition (PVD) system. The 300mm system will be used for advanced Through-Silicon-Via (TSV) development at Leti’s newly-inaugurated 300mm fab extension in Grenoble, France. This system win comes on the heels of an October 2010 agreement between Leti and SPTS to collaborate Read More>>
By Francoise von Trapp On Oct. 20, 2010
Imec Taiwan has signed the co-funding contract with the Taiwanese Ministry of Economic Affairs (MOEA) for its R&D activity Imec Taiwan Innovation Centre (ITIC). ITIC’s goal is to expedite applied research projects with industry and academia that will result in electronic designs, components and technology solutions. The new R&D centre will focus on a variety of innovative applications in Read More>>