By Francoise von Trapp On Apr. 17, 2012
The 3D-IC LinkedIn Group announced today that it has reached more than 1,100 members. The discussion forum for 3D Integrated Circuits (3D-ICs) was established in July of 2011. The increasing level of interest shown by the industry in the past few months makes this LinkedIn Group a good opportunity for industry professionals to update themselves with the latest trends in the field. The group has experienced Read More>>
By Q3D Notes On Apr. 11, 2012
Invensas Corporation, provider of semiconductor technology solutions and wholly owned subsidiary of Tessera Technologies, Inc., introduced its DIMM-IN-A-PACKAGETM multi-die face-down (xFD)TM technology for thin and light notebooks, also known as UltrabooksTM, and tablet computers. Invensas’ novel solution delivers the memory capacity and performance of a small outline dual in-line memory module Read More>>
By Q3D Notes On Apr. 11, 2012
Georgia Tech Packaging Research Center (GT-PRC), through an industry consortium of about ~15 semiconductor, package and supply-chain companies from US, Europe and Asia, has been pioneering ultra-miniaturized electronics by Embedded MEMS, Actives and Passives (EMAP) Technology with chip-last (CL) interconnections but with chip-first benefits to demonstrate ultra-miniaturized modules with digital, Read More>>
By Q3D Notes On Mar. 30, 2012
Amkor Technology, Inc. provider of semiconductor packaging and test services, has granted SHINKO Electric Industries Co, Ltd. a non-exclusive license to its proprietary Through Mold Via (“TMV®”) technology. The agreement provides for the transfer of Amkor’s TMV® technology to SHINKO and a license under Amkor’s patents to enable SHINKO to manufacture packages based on this technology. The Read More>>
3
By Francoise von Trapp On Mar. 06, 2012
Semiconductor test and advanced packaging service provider, STATS ChipPAC Ltd. announced its next-generation three dimensional (3D) embedded Wafer Level Ball Grid Array (eWLB) Package-on-Package (PoP) solutions. This innovative new 3D technology provides an ultra thin package profile height below 1.0mm, a 30% height reduction over the industry standard 1.4mm total stacked package height. Market demand Read More>>