By Q3D Notes On Aug. 22, 2011
At SEMICON West 2011, Prof. Rao Tummala of Georgia Tech presented the unique glass and silicon-based 3D Interposer technologies being developed at Georgia Tech, claimed to be simpler and cheaper than 3D ICs with TSV for many mobile and consumer applications at SemiconWest 2011.  in his presentation, Tummala discussed the primary differences and challenges between traditional industry's approach to Read More>>
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By Francoise von Trapp On Sep. 22, 2009
Here’s the story. Sound Design Technologies has a solid history as a component supplier to the hearing instrument market, which accounts for the sound design interpretation. But it has expanded to add a vertically integrated contract manufacturing unit, specializing in design, fabrication, and assembly of packaging technologies targeted for the medical devices markets. Thus the current meaning of the name: Sound DESIGN Technologies. I first learned about this niche player at the Medical Electronics Symposium presented by MEPTEC and the SMTA, held last week at ASU in Tempe, AZ. Read More>>
By Francoise von Trapp On Jan. 28, 2011
Last week (January 18 and 19, 2011), Leti lit up Grenoble, France with the inauguration of its 300mm 3D integration, christening the region as “The Grenoble Valley ecosystem for 3D Integration.” The two-day event brought together Leti’s 3D common lab partners, spanning the supply chain to include industry partners (ST Microelectronics and ST Ericsson), equipment manufacturers (SPTS, EV Group, Read More>>
By Q3D Notes On Nov. 16, 2010
Keith Cooper, Technology and Development, SET North America reports from 2010 IMAPS International , where he attended the 3D Panel, “Roadmap, Technical and Business Progress of 3D Integration and Packaging”. At the recent IMAPS Annual Meeting in Raleigh, NC, a panel of 3D experts addressed a series of questions moderated by Prof. James Lu of RPI.   While individual opinions on the panel Read More>>
By Q3D Notes On Aug. 25, 2010
A critical challenge for fabricating 3D products is the integration of the dies with through-silicon vias (TSVs) into functioning and reliable 3D stacks. As a way to assess and overcome the risks, imec has created the SmartSamples platform. SmartSamples allow validating 3D stacks before the actual product design, avoiding costly re-spins and additional expenses. They are IC emulators, prototype 3D Read More>>