By Q3D Notes On Dec. 08, 2010
SEMATECH, the Semiconductor Industry Association (SIA), and Semiconductor Research Corporation (SRC) announced today they have established a new 3D Enablement program to drive cohesive industry standardization efforts and technical specifications for heterogeneous 3D integration.  Administered by SEMATECH’s 3D Interconnect program, based at the College of Nanoscale Science and Engineering (CNSE) Read More>>
By Q3D Notes On Nov. 08, 2010
SPP Process Technology Systems (SPTS) announced the opening of its new facility in San Jose, CA, serving as the home for the company’s Thermal Products Division, and sales and support headquarters for North America. The Thermal Products Division was relocated from Scotts Valley, California. In October 2009, Sumitomo Precision Products (SPP) acquired assets of Aviza Technology and subsequently integrated Read More>>
By Q3D Notes On Jan. 24, 2011
In a move that promises to provide increased performance and smaller size for portable electronics and other advanced systems, CEA-Leti has signed a multiyear agreement with SHINKO Electric Industries, Co. Ltd. (“SHINKO”) to develop advanced semiconductor packaging technology. The work, which will be part of Leti’s broader efforts in advanced silicon substrates, will focus on silicon interposers, Read More>>
By Francoise von Trapp On Oct. 20, 2010
Imec Taiwan has signed the co-funding contract with the Taiwanese Ministry of Economic Affairs (MOEA) for its R&D activity Imec Taiwan Innovation Centre (ITIC). ITIC’s goal is to expedite applied research projects with industry and academia that will result in electronic designs, components and technology solutions. The new R&D centre will focus on a variety of innovative applications in Read More>>
By Q3D Notes On Sep. 09, 2009
Elpida Memory announced that it has completed development of a Cu-TSV multi-layer 8-Gigabit DRAM. Elpida reportedly began developing TSV in 2004 based on a Grant Program provided by the New Energy and Industrial Technology Development Organization (NEDO), a research endeavor founded by the Japanese government. Since then Elpida has continued to develop TSV technology. Read More>>