By Francoise von Trapp On Oct. 31, 2011
Last week, I read a very interesting report from SEMICON Europa concerning the cost of development for 450mm reaching between $20 and 40B ; and that this could force a choice between funding 450 and funding More than More(including 3DIC) developments. Two comments, in particular, caught my interest. One by Georg Kelm, head of the European Commission’s Nanoelectronics sector, who noted that "with Read More>>
By Francoise von Trapp On Dec. 14, 2010
The enthusiasm was contagious at last week's 3-D Architectures for Semiconductor Integration and Packaging symposium in Burlingame. Silicon interposers were hot, R&D institutes from around the world weighed in with their program updates, suppliers provided process updates, and some of the major EDA houses offered their perspectives and progress in tool development. Standards were also a focus of Read More>>
By Francoise von Trapp On Oct. 14, 2010
Much of the manufacturing equipment, processes, modeling and simulation tools, and materials being investigated for 3D IC integration technologies were first developed for MEMS fabrication and packaging. This discussion will examine how advancement of MEMS manufacturing processes help further the advancement of 3D IC and vice-versa.  We will look at synergies in the supply chain and discuss how Read More>>
By Francoise von Trapp On Jul. 16, 2010
There is still work being done to perfect various processes needed to manufacture TSVs that are reliable and cost effective. This discussion will focus on what was featured this year at SEMICON West to help iron out the kinks. Read More>>
By Francoise von Trapp On Jul. 16, 2010
Is your company embracing 3D packaging solutions that don't involve TSVs?  This is your discussion. We'll be looking at 3D solutions that embrace the existing infrastructure, or require little adaptation to bring to market. Read More>>