By Francoise von Trapp On Feb. 04, 2010
Join 3D InCites from February 8-12, 2010, as we discuss opportunities for enhancing system performance using through silicon via (TSV) technology with Madhavan Swaminathan, Gene Jakubowski and Bill Martin, the executive team of E-System Design, a company focusing on the development of CAD tools for Read More>>
By Francoise von Trapp On Apr. 21, 2010
By design, MEMS devices are already 3D stuctures, so when we talk about 3D MEMS, we’re actually talking about the integration of ICs and multiple MEMS sensors in the third dimension to create advanced “smart” systems. Read More>>
By Francoise von Trapp On Mar. 22, 2010
Panelists and Participants: Welcome to the 3D wafer-level packaging (3D WLP) discussion in this week’s 3D Packaging update forum. Please join in the discussion by logging in and posting your questions and comments here. Read More>>
By Francoise von Trapp On Jul. 16, 2010
There is still work being done to perfect various processes needed to manufacture TSVs that are reliable and cost effective. This discussion will focus on what was featured this year at SEMICON West to help iron out the kinks. Read More>>
By Francoise von Trapp On Mar. 22, 2010
Panelists and Participants: Welcome to the 3D system-in-package (3D SiP) discussion in this week’s 3D Packaging update forum. Please join in the discussion by logging in and posting your questions and comments here. Read More>>