By Francoise von Trapp On Mar. 22, 2010

Panelists and Participants: Welcome to the 3D system-in-package (3D SiP) discussion in this week’s 3D Packaging update forum. Please join in the discussion by logging in and posting your questions and comments here. Read More>>

By Francoise von Trapp On Apr. 21, 2010

By design, MEMS devices are already 3D stuctures, so when we talk about 3D MEMS, we’re actually talking about the integration of ICs and multiple MEMS sensors in the third dimension to create advanced “smart” systems. Read More>>

By Francoise von Trapp On Apr. 28, 2010

When it comes to stacking 3D die stacking with TSV, there are 3 basic approaches being considered: chip-to-chip (C2C), Chip-to-Wafer(C2W) and Wafer-to-Wafer (W2W). The first of these to reach commercialization is C2C, but development continues in the other two areas in hopes of increased throughput and yield, thereby reducing cost. Read More>>