At IMAPS International DPC 2012, Steve Anderson, Product Marketing Manager, STATS ChipPAC, tal... Read More>>

Using a 110MHz transducer, ultrasonic soundwaves are transmitted or reflected through a bonded... Read More>>

The FC300 is high-precision die bonding tool capable of both die-to-die and die-to-wafer bondi... Read More>>

Overview of the ECPR process that employs a template to fabricate metal patterns in a single r... Read More>>

The Gemini is a fully automated 300mm wafer bonding tool. It also has modules for precision wa... Read More>>